BGA site modification, one of the approaches of BGA rework, is a method typically used for engineering changes and modifications that can help restore the device for its best functioning and usage when a device is not functioning. BGA rework is crucial for maintaining and working the device or equipment when there is a problem with the BGA pad. The requirement of adding a jumper wire at the site of BGA is one of the most typical BGA site modifications. Running a jumper through a board hole is one possibility. To know more, read this blog: https://www.solder.net/blog/modify-site-of-bga-component/.
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